In:
Journal of Applied Physics, AIP Publishing, Vol. 78, No. 10 ( 1995-11-15), p. 6108-6112
Kurzfassung:
A new ohmic contact system, Ge/Pt/Ge/Pt/n-InP, was studied systematically by measuring its specific contact resistance and by using Auger electron spectroscopy, x-ray-diffraction analysis, Rutherford backscattering spectroscopy, and scanning electron microscopy. It was found that the system has a wide temperature range for annealing, i.e., 450–550 °C, to achieve the specific contact resistance of the order of 1.0×10−5 Ω cm2. It can achieve a low specific contact resistance of 7.71×10−6 Ω cm2 when it is subjected to rapid thermal annealing at 500 °C for 30 s. The whole process is a solid phase reaction so that a smooth surface morphology is obtained. The ohmicity is due to the heavy doping of Ge in the regrown InP film. The contact system exhibits good thermal stability, being able to maintain a low specific contact resistance of 9.15×10−6 Ω cm2 for 20 h, 400 °C aging, and 2.77×10−5 Ω cm2 for 80 h aging.
Materialart:
Online-Ressource
ISSN:
0021-8979
,
1089-7550
Sprache:
Englisch
Verlag:
AIP Publishing
Publikationsdatum:
1995
ZDB Id:
220641-9
ZDB Id:
3112-4
ZDB Id:
1476463-5
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