In:
Applied Physics Letters, AIP Publishing, Vol. 78, No. 18 ( 2001-04-30), p. 2652-2654
Abstract:
Electromigration results have provided clear evidence of a short or “Blech” length effect in dual- damascene, Cu/oxide, multilinked interconnects. The test structure incorporates a repeated chain of Blech-type line elements and is amenable to failure analysis tools such as focused ion beam imaging. This large interconnect ensemble provides a statistical representation of electromigrationinduced damage in the regime where steady-state interconnect stress is manifest. Statistical analysis yields a critical length of 90 μm for interconnects with line width 0.5 μm at j=1.0×106 A/cm2 and T=325 °C.
Type of Medium:
Online Resource
ISSN:
0003-6951
,
1077-3118
Language:
English
Publisher:
AIP Publishing
Publication Date:
2001
detail.hit.zdb_id:
211245-0
detail.hit.zdb_id:
1469436-0
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