In:
ECS Transactions, The Electrochemical Society, Vol. 16, No. 22 ( 2009-03-20), p. 77-85
Abstract:
Deposition behavior of localized electroless NiB deposition for pad-to-pad connection was investigated. Localized deposition occurred mainly on the area between facing pads, and anisotropic deposition toward each facing pad was obtained. Thus, this connection, "preferential bridge connection", is no need of photolithographic technique. These results indicated that this process is one of the maskless fabrication processes. Moreover, chemical flip-chip bonding containing preferential bridge interconnection was demonstrated. The chip-to-substrate interconnection with 30 micrometer pitch was successfully achieved.
Type of Medium:
Online Resource
ISSN:
1938-5862
,
1938-6737
Language:
Unknown
Publisher:
The Electrochemical Society
Publication Date:
2009
Permalink