In:
Journal of Applied Physics, AIP Publishing, Vol. 97, No. 10 ( 2005-05-15)
Abstract:
NiFe films with different thicknesses as were etched under several Ar+-ion-beam energy conditions. The functional dependence of the saturation magnetic flux on the remaining NiFe film thickness was used to determine the magnetic dead layer (MDL) thickness (tMDL). A tMDL of 24Å was generated in the NiFe films etched using a 1200-eV Ar+-ion beam. A dual-energy (1200eV∕400eV) etching process was found to be effective in reducing tMDL to 16Å without much throughput loss. A combination of optimal etching depth with an appropriate ion-beam energy is necessary in minimizing tMDL. The mechanism of MDL formation is discussed in terms of oxidation and surface roughening of the NiFe films.
Type of Medium:
Online Resource
ISSN:
0021-8979
,
1089-7550
Language:
English
Publisher:
AIP Publishing
Publication Date:
2005
detail.hit.zdb_id:
220641-9
detail.hit.zdb_id:
3112-4
detail.hit.zdb_id:
1476463-5
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