In:
Advanced Materials Research, Trans Tech Publications, Ltd., Vol. 76-78 ( 2009-6), p. 428-433
Abstract:
Chemo-mechanical grinding (CMG) process is a promising process for large-sized Si substrate fabrication at low cost. An encountered issue in current CMG process of Silicon (Si) wafers is metallic contaminations on ground Si wafer surface, which is attributed to the existence of sodium carbonate in wheel compounds. In this paper, four different CMG wheels were developed and grinding experiments were conducted to study the effects of exclusion of sodium carbonate and concentration of ceria abrasive on grinding performance. The grinding characteristics of the four wheels were analysized and discussed to reveal the effects of different compositions.
Type of Medium:
Online Resource
ISSN:
1662-8985
DOI:
10.4028/www.scientific.net/AMR.76-78
DOI:
10.4028/www.scientific.net/AMR.76-78.428
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2009
detail.hit.zdb_id:
2265002-7
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