In:
Applied Physics Letters, AIP Publishing, Vol. 87, No. 12 ( 2005-09-19)
Abstract:
Tantalum adhesion on SiLK™ was investigated using first-principles method based on density functional theory. Phenylene groups were found to play a major role and the adjacent semi-benzene rings also contribute significantly to Ta adhesion on SiLK™. In addition, the degradation effects of H2∕He reactive plasma clean on Ta adhesion on SiLK™ was investigated. Based on our findings, argon plasma treatment was suggested and implemented after reactive plasma cleaning process, which resulted in integration of SiLK™ with Cu up to seven metal layers.
Type of Medium:
Online Resource
ISSN:
0003-6951
,
1077-3118
Language:
English
Publisher:
AIP Publishing
Publication Date:
2005
detail.hit.zdb_id:
211245-0
detail.hit.zdb_id:
1469436-0
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