In:
Solid State Phenomena, Trans Tech Publications, Ltd., Vol. 121-123 ( 2007-3), p. 29-32
Abstract:
Direct Wafer Bonding has been widely developed and is very attractive for a lot of applications. Using original techniques based on direct bonding enable to carry out specific engineered substrates. Various illustrations are given among which twisted Si-Si bonded substrates, where buried dislocation networks play a key role in the subsequent elaboration of nanostructures.
Type of Medium:
Online Resource
ISSN:
1662-9779
DOI:
10.4028/www.scientific.net/SSP.121-123
DOI:
10.4028/www.scientific.net/SSP.121-123.29
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2007
detail.hit.zdb_id:
2051138-3
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