In:
Advanced Materials Research, Trans Tech Publications, Ltd., Vol. 711 ( 2013-6), p. 251-256
Abstract:
In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ±1.5% during heating to 120°C. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type (300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various screen mesh (40, 80, 120) were used as the structure and chamber was changed.
Type of Medium:
Online Resource
ISSN:
1662-8985
DOI:
10.4028/www.scientific.net/AMR.711
DOI:
10.4028/www.scientific.net/AMR.711.251
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2013
detail.hit.zdb_id:
2265002-7
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