In:
Crystals, MDPI AG, Vol. 9, No. 4 ( 2019-04-11), p. 202-
Abstract:
In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.
Type of Medium:
Online Resource
ISSN:
2073-4352
DOI:
10.3390/cryst9040202
Language:
English
Publisher:
MDPI AG
Publication Date:
2019
detail.hit.zdb_id:
2661516-2
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