In:
IOP Conference Series: Materials Science and Engineering, IOP Publishing, Vol. 677, No. 5 ( 2019-12-01), p. 052096-
Abstract:
Based on simulation, the structure optimization of a Cu evaporation substrate in natural cooling system is conducted, which can be used in power electronics equipment. The relationship between the welding area ratio and stress of evaporation substrate is investigated. The evaporation substrate is one of the most important components in a natural cooling system. Through utilizing phase-transition technology, heat dissipation is realized by a natural cooling system. During operation of evaporation substrate, increase in internal gas pressure, caused by the evaporation of working fluid, leads to deformation of evaporation substrate. Therefore, strengthen-columns are introduced to reinforce the evaporation substrate. Both Pro/E simulation outcomes and experimental results based on structure optimization of evaporation substrate indicate that the optimal design is achieved at a welding area ratio of 1.844%, namely the arrangement of strengthen-columns is 11 × 14 × 3 mm. With this arrangement, the minimum stress on welding surfaces of strengthen-columns and minimum deformation of the evaporation substrate are achieved, which can meet the engineering requirement.
Type of Medium:
Online Resource
ISSN:
1757-8981
,
1757-899X
DOI:
10.1088/1757-899X/677/5/052096
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2019
detail.hit.zdb_id:
2506501-4
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