In:
Materials Science Forum, Trans Tech Publications, Ltd., Vol. 1035 ( 2021-06-22), p. 787-791
Abstract:
The FEM (finite element method) simulation was used to study the diffusion bonding deformation of high purity tungsten target. The influence of different welding structure, bonding temperature on the deformation of the final high-purity tungsten target was systematically studied. Meanwhile, some microscopic properties of tungsten target were developed, such as internal stress size and distributions, strain size and distributions. Finally, physical experiments are used to verify numerical simulation results. The results show that the method of adding an intermediate layer can release the residual stress between the high-purity target and back plate. The bonding stress of high-purity tungsten target is mainly concentrated with the tungsten target and the intermediate layer in between, which is easy to fail during the later leveling process. Small deformation of bonding tungsten target can be obtained by low diffusion bonding temperature.
Type of Medium:
Online Resource
ISSN:
1662-9752
DOI:
10.4028/www.scientific.net/MSF.1035
DOI:
10.4028/www.scientific.net/MSF.1035.787
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2021
detail.hit.zdb_id:
2047372-2
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