In:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, American Vacuum Society, Vol. 20, No. 5 ( 2002-09-01), p. 1769-1773
Abstract:
The effects of nitrogen postplasma treatment on the properties of a Cu/Ta/a-C:F structure were investigated. Interface reactions between Ta and a-C:F were also examined. A strong interaction between Ta and a-C:F at the interface and defluorination of a-C:F film occurred during Ta sputter deposition. Ta fluoride was observed at the interface between Ta and a-C:F, which led to adhesion and reliability problems. In order to suppress the reaction at the interface, nitrogen plasma was applied to the as-deposited a-C:F film. The fluorine concentration of the film surface decreases with plasma treatment. As the plasma treatment power increases, the adhesion between Ta and a-C:F film improved. From this study, it was found that nitrogen plasma treatment of a-C:F films is a very effective method for suppression of defluorination of a-C:F film and the interface reaction between Ta and a-C:F film.
Type of Medium:
Online Resource
ISSN:
0734-2101
,
1520-8559
Language:
English
Publisher:
American Vacuum Society
Publication Date:
2002
detail.hit.zdb_id:
1475424-1
detail.hit.zdb_id:
797704-9
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