In:
Applied Mechanics and Materials, Trans Tech Publications, Ltd., Vol. 55-57 ( 2011-5), p. 1468-1472
Abstract:
Using elastoplastic finite element method study the interface stress distribution of Sn3.5Ag0.75Cu lead-free solder at different temperatures and different strain rate. Numerical analysis results show that: when strain-rate is identical, as the temperature rises, the interface stress increased rapidly of Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites, from 11 °C when 2.6MPa rose to 90 °C in 49.7MPa, so the temperature is very large have effects of the interface stress of the lead-free solder and the substrate binding sites; when the temperature is constant, as the strain rate increases, Sn3.5Ag0.75Cu lead-free solder and the substrate binding sites of the interface stress showed a slight increase, from 0.005% / S when the 49.47MPa rose to 0.005% / S when the 50.08MPa, so strain rate on lead-free solder and the substrate binding sites of the interface stress effect is very small, indicating Sn3 .5Ag0.75Cu lead-free solder has strong rate-independent nature.
Type of Medium:
Online Resource
ISSN:
1662-7482
DOI:
10.4028/www.scientific.net/AMM.55-57
DOI:
10.4028/www.scientific.net/AMM.55-57.1468
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2011
detail.hit.zdb_id:
2251882-4
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