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  • IOP Publishing  (2)
  • Wasa, Kiyotaka  (2)
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  • IOP Publishing  (2)
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  • 1
    Online-Ressource
    Online-Ressource
    IOP Publishing ; 1988
    In:  Japanese Journal of Applied Physics Vol. 27, No. 1R ( 1988-01-01), p. 30-
    In: Japanese Journal of Applied Physics, IOP Publishing, Vol. 27, No. 1R ( 1988-01-01), p. 30-
    Kurzfassung: The influence of deposition conditions on the hydrogen concentration and bond configurations in silicon nitride (SiN) films prepared by the electron cyclotron resonance plasma CVD(ECR P-CVD) method has been studied in comparison with those prepared by a conventional plasma CVD(P-CVD) method, by means of secondary ion mass spectrometry (SIMS), infrared absorption (IR) spectra and electron spin resonance (ESR). SiN films deposited at low microwave powers and a relatively high SiH 4 flow rate had higher H concentrations than those deposited at high microwave powers. The hydrogen concentration was found to be in the range from 1.3×10 22 -5×10 21 /cm 3 (13.8-4.7%) at microwave powers between 50 and 500 W. The bond configurations in the films are markedly dependent upon the deposition conditions. SiN films with only N-H bonds are thermally stable, even after annealing at 900°C in a dry N 2 atmosphere, while almost all the H atoms are lost after annealing for films with both N-N and Si-H bonds. Annealing studies by ESR measurements revealed that the H concentration in the films has little influence on the spin density.
    Materialart: Online-Ressource
    ISSN: 0021-4922 , 1347-4065
    RVK:
    RVK:
    RVK:
    Sprache: Unbekannt
    Verlag: IOP Publishing
    Publikationsdatum: 1988
    ZDB Id: 218223-3
    ZDB Id: 797294-5
    ZDB Id: 2006801-3
    ZDB Id: 797295-7
    Standort Signatur Einschränkungen Verfügbarkeit
    BibTip Andere fanden auch interessant ...
  • 2
    In: Japanese Journal of Applied Physics, IOP Publishing, Vol. 27, No. 9R ( 1988-09-01), p. 1609-
    Kurzfassung: The compositional properties of silicon nitride (SiN) and silicon oxynitride (SiON) films prepared by electron cyclotron resonance plasma CVD (ECR P-CVD) and conventional plasma CVD (P-CVD) methods have been investigated and compared. SiH 4 -N 2 gas was used for SiN depositions in both methods. O 2 gas and N 2 O gas were added to SiH 4 -N 2 gas for SiON film formations in ECR and P-CVD depositions, respectively. SiN films with the N/Si ratio in excess of a stoichiometric value and predominantly with N-H bonds are more easily obtained by the ECR P-CVD method than by the P-CVD method. Hydrogen concentrations were found to be nearly the same in the SiN films deposited by both methods in the microwave powers and rf power of 150-500 W. The addition of O 2 and N 2 O gases to the SiH 4 -N 2 resulted in an increase in the deposition rates of SiON films of about 1.5 times that of SiN films. A slight addition of O 2 and N 2 O gases resulted in a decrease in the absorption due to Si-H bonds and an increase in the absorption due to N-H bonds. Additions of more than a certain amount of O 2 or N 2 O gases resulted in the disappearance of Si-H and N-H bonds. However, hydrogen atoms were found to be still contained in SiON films, although the concentration is a little low in comparison with those in SiN films. The excited states of oxygen are considered to have great influence on such film compositions.
    Materialart: Online-Ressource
    ISSN: 0021-4922 , 1347-4065
    RVK:
    RVK:
    RVK:
    Sprache: Unbekannt
    Verlag: IOP Publishing
    Publikationsdatum: 1988
    ZDB Id: 218223-3
    ZDB Id: 797294-5
    ZDB Id: 2006801-3
    ZDB Id: 797295-7
    Standort Signatur Einschränkungen Verfügbarkeit
    BibTip Andere fanden auch interessant ...
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