In:
ACM Journal on Emerging Technologies in Computing Systems, Association for Computing Machinery (ACM), Vol. 18, No. 1 ( 2022-01-31), p. 1-49
Abstract:
Monolithic 3D (M3D) is an emerging heterogeneous integration technology that overcomes the limitations of the conventional through-silicon-via (TSV) and provides significant performance uplift and power reduction. However, the ultra-dense 3D interconnects impose significant challenges during physical design on how to best utilize them. Besides, the unique low-temperature fabrication process of M3D requires dedicated design-for-test mechanisms to verify the reliability of the chip. In this article, we provide an in-depth analysis on these design and test challenges in M3D. We also provide a comprehensive survey of the state-of-the-art solutions presented in the literature. This article encompasses all key steps on M3D physical design, including partitioning, placement, clock routing, and thermal analysis and optimization. In addition, we provide an in-depth analysis of various fault mechanisms, including M3D manufacturing defects, delay faults, and MIV (monolithic inter-tier via) faults. Our design-for-test solutions include test pattern generation for pre/post-bond testing, built-in-self-test, and test access architectures targeting M3D.
Type of Medium:
Online Resource
ISSN:
1550-4832
,
1550-4840
Language:
English
Publisher:
Association for Computing Machinery (ACM)
Publication Date:
2022
detail.hit.zdb_id:
2193538-5
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