In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 61, No. 4 ( 2022-04-01), p. 046501-
Abstract:
Non-destructive depth profile evaluation of multi-layer thin film stacks using simultaneous analysis of angle-resolved X-ray photoelectron spectroscopy data from multiple instruments is demonstrated. The data analysis algorithm, called the maximum smoothness method, was originally designed to handle data from a single XPS instrument with a single X-ray energy; in this work, the algorithm is extended to provide a simultaneous analysis tool which can handle data from multiple instruments with multiple X-ray energies. The analysis provides depth profiles for multilayer stacks that cannot be obtained by conventional data analysis methods. In this paper, metal multi-layer stack samples with total thickness greater than 10 nm are analyzed with the maximum smoothness method to non-destructively obtain depth profiles, with precise information on the chemical states of atoms in the surface layer ( 〈 2 nm) and the overall layer stack structure, which can only be obtained by analyzing the data from multiple instruments.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.35848/1347-4065/ac4a09
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2022
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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