In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 39, No. 7S ( 2000-07-01), p. 4438-
Abstract:
Electromigration of Ag on Au-precovered Si(111) surfaces was investigated by in-situ ultrahigh vacuum scanning electron microscopy and µ-probe reflection-high-energy electron diffraction (RHEED). Migration behaviors of a Ag-film patch strongly depended on Au coverage θ Au and corresponding surface structures. When θ Au 〈 0.7 monolayer (ML), the patch expanded preferentially towards the cathode to attain a maximum area in which the sum of Ag and Au coverages were always about 1 ML irrespective of θ Au , resulting in two-dimensional (2D) alloy phases (showing √3×√3 RHEED patterns) with different Au/Ag concentration ratios. The largest expansion of the patch area was achieved on a (5×2+α-√3×√3)-Au mixed phase structure (θ Au ∼0.7 ML). However, when θ Au 〉 0.7 ML, the patch expansion was greatly reduced. Especially on the β-√3×√3-Au surface (θ Au ∼1.0 ML), the patch showed no directional expansion towards the cathode. But Ag atoms were observed to migrate inside the patches on all substrates (including the β-√3×√3-Au surface) to form 3D islands near terrace edges.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.39.4438
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2000
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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