In:
Journal of Engineering Materials and Technology, ASME International, Vol. 128, No. 2 ( 2006-04-01), p. 142-150
Abstract:
This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter.
Type of Medium:
Online Resource
ISSN:
0094-4289
,
1528-8889
Language:
English
Publisher:
ASME International
Publication Date:
2006
detail.hit.zdb_id:
240776-0
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