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  • SAGE Publications  (2)
  • Qu, Chunyan  (2)
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  • SAGE Publications  (2)
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  • 1
    In: High Performance Polymers, SAGE Publications, Vol. 32, No. 1 ( 2020-02), p. 116-126
    Abstract: Two new monomers were prepared by the reaction of 2-allylphenol and 4,4′-biphenyldicarbonyl chloride under different reaction conditions. The monomers were characterized by Fourier transform infrared spectroscopy and nuclear magnetic resonance spectroscopy. The curing processes of N, N-4,4′-bismaleimidodiphenylmethyene with 4,4′-bis(2-allylphenyl) biphenyldicarbonylate (BABC) and 4,4′-bis(2-propenylphenyl benzoate) ether (BPBE) were studied by rheological analysis and differential scanning calorimetry. Melting points of two monomers, BABC and BPBE, are 64°C and 121°C, respectively. The ABMI [4,4′-bis(2-allylphenyl)biphenyl bismaleimide] and PBMI [4,4′-bis(2-propenylphenyl)biphenyl bismaleimide] resins showed exothermic peaks at 233°C and 204°C, respectively. The measured melting points are significantly lower than that of the traditional bismaleimide resin which is modified by allyl bisphenol A. Dynamic mechanical analysis of the materials showed glass transition temperatures of ABMI and PBMI to be in the range of 213–258°C and 302–339°C, respectively. Thermogravimetric analysis of the cured resins showed 5% weight loss for ABMI and PMBI at 437°C and 428°C, along with char residues of 35.6–39.5%, respectively, at 800°C under nitrogen atmosphere. Furthermore, dielectric constants of propenyl-modified resins were lower (2.46–3.10) with dissipation factors of 0.0034–0.0036, compared with those of allyl bisphenol A resins.
    Type of Medium: Online Resource
    ISSN: 0954-0083 , 1361-6412
    Language: English
    Publisher: SAGE Publications
    Publication Date: 2020
    detail.hit.zdb_id: 1483713-4
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  • 2
    Online Resource
    Online Resource
    SAGE Publications ; 2020
    In:  High Performance Polymers Vol. 32, No. 5 ( 2020-06), p. 559-568
    In: High Performance Polymers, SAGE Publications, Vol. 32, No. 5 ( 2020-06), p. 559-568
    Abstract: The choice of basic epoxy resin (ER) is especially important for the design of epoxy adhesive formulations. In the present study, performance of several high-temperature ER systems, prepared using 4,4-diaminodiphenylsulfone as the curing agent by the same curing process, was investigated. The curing behavior was studied by dynamic rheometry and differential scanning calorimetry. The thermal properties of the cured resins were investigated by dynamic thermomechanical analysis, thermomechanical analysis, and thermogravimetric analysis. The peeling properties, mechanical behaviors, and moisture absorptivities of the cured resins were also studied. The results showed traditional diglycidyl ether of bisphenol A epoxy to be insufficient in heat resistance. Naphthalene-based ER and bifunctional cardo ER showed higher glass transition temperature values. However, the processability and adhesive properties may not comply with the application requirements. Biphenyl novolac ER has excellent performance in all aspects, which is suitable for use as a high-temperature adhesive.
    Type of Medium: Online Resource
    ISSN: 0954-0083 , 1361-6412
    Language: English
    Publisher: SAGE Publications
    Publication Date: 2020
    detail.hit.zdb_id: 1483713-4
    Location Call Number Limitation Availability
    BibTip Others were also interested in ...
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