In:
Journal of Micromechanics and Microengineering, IOP Publishing, Vol. 32, No. 1 ( 2022-01-01), p. 015004-
Kurzfassung:
Thermopile sensors have a wide range of applications in consumer and industry. Seebeck coefficient is a basic thermal parameter of thermopile sensors. Extracting the Seebeck coefficient of both materials and thermocouple in thermopile sensors is of great importance. In this work, an on-chip test structure is designed. It consists of a substrate, a framework, supporting legs and a sensitive region which has a resistor serving as both heater and temperature detector. A set of on-chip test structures are fabricated along with a thermopile sensor. Its measurement results are analyzed and compared with apparatus measurement results. These results are consistent with each other, and the validity of structure is verified.
Materialart:
Online-Ressource
ISSN:
0960-1317
,
1361-6439
DOI:
10.1088/1361-6439/ac3be1
Sprache:
Unbekannt
Verlag:
IOP Publishing
Publikationsdatum:
2022
ZDB Id:
1480280-6
ZDB Id:
1069644-1
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