In:
Key Engineering Materials, Trans Tech Publications, Ltd., Vol. 329 ( 2007-1), p. 367-372
Abstract:
The single crystal of Si is still one of the most important candidates among other materials
including Single crystals of SiC, GaN, C(diamond) or compound semiconductors. The innovative process as called CMG(Chemo-Mechanical-Grinding) for Si wafer has been recently developed
which is different from conventional CMP(Chemo-Mechanical-Polishing ) process. The CMG process can be done under dry conditions using CeO2 based solid bulk abrasives. The microstructures
for surface and subsurface of Si single crystal after CMG process were analyzed using TEM/EDX, AFM, MFP-3D Microscope. The mechanism of CMG process was also investigated by X-ray
diffraction and ICP chemical analysis using products by chemical reaction between Si and CeO2 abrasives. The results showed that Si single crystal after CMG had, 1) no defects even Si lattice revel
or mechanical imperfections,2) better surface roughness as compared to CMP process. The CMG mechanism concluded that CeO2 reacted with Si producing Ce-Si-O amorphous phase.
Type of Medium:
Online Resource
ISSN:
1662-9795
DOI:
10.4028/www.scientific.net/KEM.329
DOI:
10.4028/www.scientific.net/KEM.329.367
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2007
detail.hit.zdb_id:
2073306-9
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