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  • Ishida, Satomi  (4)
  • 2015-2019  (4)
  • 2016  (4)
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  • 2015-2019  (4)
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  • 2016  (4)
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  • 1
    In: ECS Transactions, The Electrochemical Society, Vol. 75, No. 8 ( 2016-08-18), p. 199-209
    Abstract: Ge waveguides (WGs) were fabricated on an SiO 2 layer by combining epitaxial lateral overgrowth, chemical mechanical polishing (CMP), and reactive ion etching (RIE) of a Ge layer selectively grown on SiO 2 patterns using low pressure chemical vapor deposition. Selectivity was promoted by increasing growth temperature; length of the epitaxial lateral overgrown Ge layer reached 5 μm on the SiO 2 layer under conditions of optimal selective growth at a temperature of 750°C. The Ge layers were planarized by using CMP down to a thickness of 1 μm, and then Ge WGs as active regions for light emitting devices were formed by using RIE on the planarized Ge layers. After defective regions around the Ge/Si interface were removed, four-times-higher photoluminescence was obtained from the Ge WGs compared with one that contained the Ge/Si interface. These results indicate that this combined technique efficiently improved the performance of Ge light-emitting devices.
    Type of Medium: Online Resource
    ISSN: 1938-5862 , 1938-6737
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2016
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  • 2
    Online Resource
    Online Resource
    The Electrochemical Society ; 2016
    In:  ECS Meeting Abstracts Vol. MA2016-02, No. 30 ( 2016-09-01), p. 1936-1936
    In: ECS Meeting Abstracts, The Electrochemical Society, Vol. MA2016-02, No. 30 ( 2016-09-01), p. 1936-1936
    Abstract: The Ge laser is one of the most promising devices as a monolithic light source for high-speed optical interconnections due to its compatibility with Si processes. Although optical gain has been observed [1, 2], further improvements of crystallinity are required [3, 4] to ensure continuous wave operation of Ge lasers. In this work, we fabricated high-quality Ge waveguides using epitaxial lateral overgrowth on a SiO 2 layer and chemical mechanical polishing [5] , and we investigated its crystallographic and optical properties. An eight-inch Si wafer was used as a substrate, and a SiO 2 window was fabricated as a mask for Ge selective epitaxial growth (SEG). A Ge layer was selectively grown by using low-pressure chemical vapor deposition along with germane (GeH 4 ) as a source of Ge with H 2 carrier gas. To prevent indirect transition by filling electrons into the L-valley in the conduction band of Ge [6], we also conducted in-situ phosphorus (P) doping by supplying phosphine (PH 3 ). First, a Ge buffer layer was deposited within the SiO 2 window at 400°C and annealed at 750°C, then an additional Ge layer was selectively grown only on the Ge buffer layer at relatively high temperature. Finally, rapid thermal annealing was carried out at 850°C. By optimizing the growth pressure, the length of the epitaxial lateral overgrowth (ELO) on the SiO 2 layer was increased to more than 5 mm. Although the dislocation and stacking faults were observed around a region of the Ge on the Si substrate by transmission electron microscopy, no dislocations were evident on the ELO-Ge region grown on the SiO 2 layer. Since the thickness of the SEG-Ge layer increased as the length of the ELO increased, chemical mechanical polishing (CMP) was applied to remove the top part of the SEG-Ge layer. By using measurements of micro-Raman spectroscopy, it was confirmed that the tensile strain was remained in the ELO-Ge on SiO 2 layer even after the CMP process. Then, additional P doping was carried out by spin-on-dopant (SOD) process. The SOD solution [Filmtronics, P8545SF] was coated on the CMP-Ge layer, and the annealed at 750°C, for 10min. The maximum P concentration of 3.2×10 19 cm -3 was achieved, which was measured by secondary ion mass spectroscopy. Finally, Ge waveguides (Ge-WGs) were fabricated by reactive ion etching of the CMP-Ge layer to remove a part of the Ge layer that contained a lot of crystal defects due to the lattice mismatch between Ge and Si. Figure 1(a) shows a bird's-eye SEM image of the Ge-WG after dry etching with an offset (Dx) of 3.1 mm to the SiO 2 window. Photoluminescence (PL) spectra from the Ge-WGs with various Dx are shown in Fig. 1(b). Obvious PL spectra were observed from the Ge-WGs with peak wavelength around 1600 nm. The PL peak intensity from the Ge-WG with Dx = 3.1 mm was four-times higher than that corresponding to Dx = 0.1 mm. This result indicates that the better crystallinity of the Ge-WG was obtained at the position apart from the Ge/Si interface. This work was supported by Project for Developing Innovation Systems of the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan. References [1] R. E. Camacho-Aguilera, et al., Optics Express 20 (2012) 11316. [2] R. Koerner, et al., Optics Express 23 (2015) 14815. [3] Q. Li, et al., Appl. Phys. Lett. 85 (2004) 1928. [4] H. -Y. Yu, et al., Electron Dev. Lett. 33 (2012) 579. [5] K. Oda, et al., Jpn. J. Appl. Phys. 55 (2016) 04EH06. [6] J. Liu, et al., Opt. Lett. 35 (2010) 679. Figure 1
    Type of Medium: Online Resource
    ISSN: 2151-2043
    Language: Unknown
    Publisher: The Electrochemical Society
    Publication Date: 2016
    detail.hit.zdb_id: 2438749-6
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  • 3
    Online Resource
    Online Resource
    IOP Publishing ; 2016
    In:  Japanese Journal of Applied Physics Vol. 55, No. 4S ( 2016-04-01), p. 04EH14-
    In: Japanese Journal of Applied Physics, IOP Publishing, Vol. 55, No. 4S ( 2016-04-01), p. 04EH14-
    Abstract: We fabricate a suspended germanium cross-shaped microstructure to biaxially enhance residual tensile strain using a germanium epilayer directly grown on a silicon-on-insulator substrate. Such a suspended germanium system with enhanced biaxial tensile strain will be a promising platform for incorporating optical cavities toward the realization of germanium lasers. We demonstrate systematic control over biaxial tensile strain and photoluminescence peaks by changing structural geometry. The photoluminescence peaks corresponding to the direct recombination between the conduction Γ valley and two strain-induced separated valence bands have been clearly assigned. A maximum biaxial strain of 0.8% has been achieved, which is almost half of that required to transform germanium into a direct band-gap semiconductor.
    Type of Medium: Online Resource
    ISSN: 0021-4922 , 1347-4065
    RVK:
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    RVK:
    Language: Unknown
    Publisher: IOP Publishing
    Publication Date: 2016
    detail.hit.zdb_id: 218223-3
    detail.hit.zdb_id: 797294-5
    detail.hit.zdb_id: 2006801-3
    detail.hit.zdb_id: 797295-7
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  • 4
    In: Japanese Journal of Applied Physics, IOP Publishing, Vol. 55, No. 8S3 ( 2016-08-01), p. 08RC02-
    Abstract: We experimentally investigate the emission decay rates of self-assembled single InAs quantum dots (QDs) embedded in sub-wavelength semiconductor waveguides with and without metal side claddings. Compared with as-grown single QDs, we observe a clear suppression (enhancement) in the radiative decay rates of single InAs QDs embedded in the sub-wavelength semiconductor waveguides without (with) metal cladding, respectively. The decay rate for QDs in metal-clad waveguides is ∼2 times faster than that in waveguides without metal. Numerical calculations using models that include the effects of structural imperfections show good agreement with the experimental results, and reveal that the most important structural imperfection is the gap between the metal and the semiconductor.
    Type of Medium: Online Resource
    ISSN: 0021-4922 , 1347-4065
    RVK:
    RVK:
    RVK:
    Language: Unknown
    Publisher: IOP Publishing
    Publication Date: 2016
    detail.hit.zdb_id: 218223-3
    detail.hit.zdb_id: 797294-5
    detail.hit.zdb_id: 2006801-3
    detail.hit.zdb_id: 797295-7
    Location Call Number Limitation Availability
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