In:
Plasma Processes and Polymers, Wiley, Vol. 4, No. 3 ( 2007-04-23), p. 208-218
Abstract:
Various new plasma‐based surface technological processes are made feasible by localizing atmospheric‐pressure discharges to predefined volumes with sub‐millimeter linear dimensions. So‐called Plasma Printing processes use cold discharges in microcavities formed temporarily by contacting a substrate with a suitably designed kind of plasma stamp. Aside from dielectric barrier discharges driven by mid‐frequency (MF) AC voltages, cold microplasmas can also be sustained in arrangements without a dielectric barrier, if RF excitation is used. The modification or coating of internal surfaces in already sealed microfluidic systems promises the achievement of a wide range of physico‐chemical surface properties which are difficult to attain by wet‐chemical or low‐pressure plasma processes. Using a proper electrode arrangement, the coating or modification can be localized to a selected segment of a microfluidic system. magnified image
Type of Medium:
Online Resource
ISSN:
1612-8850
,
1612-8869
DOI:
10.1002/ppap.200600116
Language:
English
Publisher:
Wiley
Publication Date:
2007
detail.hit.zdb_id:
2159694-3
Permalink