In:
Materials Science Forum, Trans Tech Publications, Ltd., Vol. 544-545 ( 2007-5), p. 263-266
Abstract:
In the paper, the Sn2.5Ag0.7Cu solder alloy is selected out by comprehensive comparison.
Minute a mount of rare earth (RE) was added into Sn2.5Ag0.7Cu solder aiming at examining the effect of different a mount of RE on microstructure,the physical properties and mechanical
properties of Sn2.5Ag0.7Cu solder.the aim is to define the optimization range of the RE addition.
Type of Medium:
Online Resource
ISSN:
1662-9752
DOI:
10.4028/www.scientific.net/MSF.544-545
DOI:
10.4028/www.scientific.net/MSF.544-545.263
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2007
detail.hit.zdb_id:
2047372-2
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