In:
Surface and Interface Analysis, Wiley, Vol. 51, No. 5 ( 2019-05), p. 566-575
Abstract:
This study is to focus on the benzotriazole (BTA) residue problem in the postchemical mechanical planarization (post‐CMP) cleaning process. The adsorption of BTA on copper surface was studied by analyzing the FTIR spectra; it indicates that the oxidation of the copper surface could affect the adsorption of BTA on the wafer surface. It used an alkaline‐based chelating agent, ethylenediamine tetra acetic acid with four equivalents of 3,4‐diaminobutane‐1,1,2,2‐tetraol, to deal with Cu‐BTA film, compared with the tetraethyl ammonium hydroxide at the same pH of 10.3, and used X‐ray photoelectron spectroscopy (XPS) analysis to characterize the BTA residue on Cu wafer. The results show that the alkaline‐based chelating agent is very effective in removing the Cu‐BTA from the Cu surface and leaving the cuprous species to passivate the Cu surface.
Type of Medium:
Online Resource
ISSN:
0142-2421
,
1096-9918
Language:
English
Publisher:
Wiley
Publication Date:
2019
detail.hit.zdb_id:
2023881-2
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