In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 51, No. 6S ( 2012-06-01), p. 06FJ02-
Kurzfassung:
As-imprinted right-edged pillar structures were reconfigured into a tapered sidewall profile by CHF 3 -based reactive ion etch. The transmittance spectra improved as the sidewall became more tapered for longer etch times. The effect was most distinctive (28.4%) in the transmittance trench zone at wavelengths from 460 to 470 nm owing to the reduced diffraction scattering loss. The transmittance enhancement for silver-coated corrugated nanostructures was even greater (57.0%) for a tapered sidewall structure, in close agreement with the predictions of simulations. The infrared transmittance was notably reduced compared with that in the UV–visible zone, suggesting the possible applications of the structures in heat-insulated windows.
Materialart:
Online-Ressource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.51.06FJ02
Sprache:
Unbekannt
Verlag:
IOP Publishing
Publikationsdatum:
2012
ZDB Id:
218223-3
ZDB Id:
797294-5
ZDB Id:
2006801-3
ZDB Id:
797295-7
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