In:
The Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics, Japan Society of Mechanical Engineers, Vol. 2011.10, No. 0 ( 2011), p. _OS010-1-2-
Type of Medium:
Online Resource
ISSN:
2424-2837
Uniform Title:
OS010-1-2 Characterization of the Planar Arrangement Feature of Copper Interconnects by Moire Inversion Method
DOI:
10.1299/jsmeatem.2011.10._OS010-1-2
Language:
English
,
Japanese
Publisher:
Japan Society of Mechanical Engineers
Publication Date:
2011
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