In:
IEEE Transactions on Advanced Packaging, Institute of Electrical and Electronics Engineers (IEEE), Vol. 29, No. 3 ( 2006-08), p. 457-462
Type of Medium:
Online Resource
ISSN:
1521-3323
DOI:
10.1109/TADVP.2006.875078
Language:
English
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date:
2006
detail.hit.zdb_id:
2070853-1
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