In:
Modern Physics Letters B, World Scientific Pub Co Pte Ltd, Vol. 31, No. 06 ( 2017-02-28), p. 1750042-
Abstract:
Plasma etching technology is an indispensable processing method in the manufacturing process of semiconductor devices. Because of the high fluorine/carbon ratio of CF 4 , the CF 4 gas is often used for etching SiO 2 . A commercial software ESI-CFD is used to simulate the process of plasma etching with an inductively coupled plasma model. For the simulation part, CFD-ACE is used to simulate the chamber, and CFD-TOPO is used to simulate the surface of the sample. The effects of chamber pressure, bias voltage and ICP power on the reactant particles were investigated, and the etching profiles of SiO 2 were obtained. Simulation can be used to predict the effects of reaction conditions on the density, energy and angular distributions of reactant particles, which can play a good role in guiding the etching process.
Type of Medium:
Online Resource
ISSN:
0217-9849
,
1793-6640
DOI:
10.1142/S0217984917500427
Language:
English
Publisher:
World Scientific Pub Co Pte Ltd
Publication Date:
2017
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