In:
Applied Physics Letters, AIP Publishing, Vol. 96, No. 17 ( 2010-04-26)
Abstract:
The solid-state reaction and agglomeration of thin nickel-silicide films was investigated from sputter deposited nickel films (1–10 nm) on silicon-on-insulator (100) substrates. For typical anneals at a ramp rate of 3 °C/s, 5–10 nm Ni films react with silicon and form NiSi, which agglomerates at 550–650 °C, whereas films with a thickness of 3.7 nm of less were found to form an epitaxylike nickel-silicide layer. The resulting films show an increased thermal stability with a low electrical resistivity up to 800 °C.
Type of Medium:
Online Resource
ISSN:
0003-6951
,
1077-3118
Language:
English
Publisher:
AIP Publishing
Publication Date:
2010
detail.hit.zdb_id:
211245-0
detail.hit.zdb_id:
1469436-0
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