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  • Li, Wuhua  (3)
  • English  (3)
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  • English  (3)
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  • 1
    In: Energies, MDPI AG, Vol. 15, No. 5 ( 2022-02-25), p. 1722-
    Abstract: Series connection is an attractive approach to increase the blocking voltage of SiC power MOSFETs. Currently, the voltage balancing design of the series connection of the SiC MOSFETs highly relies on offline calibration and is challenging in the complex field operation. In this paper, a quantitative model to assess the voltage balancing performance is proposed to achieve a clear mathematical interpretation of the dynamic response of the voltage imbalance control loop. To begin with, an analytical model of the drain-source voltage rising time during the turn-off transient concerning the non-constant Miller plateau is proposed. Based on the turn-off model of the single device, the voltage imbalance sensitivity (VIS) is proposed to describe the influence of the parameters on the gate driving signals on the voltage imbalance. The VIS parameter can be easily achieved from the behavior of single devices, abandoning the complex variables in series connection. Further, for the typical case, active time delay voltage balancing methods are selected to demonstrate the application of the VIS analysis method. Based on VIS, the accurate close-loop design is proposed for controlling the delayed time among the devices. The proposed analysis and method are verified in simulation and experiment. The paper offers a generalized approach to assess the performance and the design of the series connection of the SiC MOSFETs, which can be further applied in many other methods for parameter design and engineering applications.
    Type of Medium: Online Resource
    ISSN: 1996-1073
    Language: English
    Publisher: MDPI AG
    Publication Date: 2022
    detail.hit.zdb_id: 2437446-5
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  • 2
    In: Energies, MDPI AG, Vol. 13, No. 10 ( 2020-05-21), p. 2613-
    Abstract: In this paper, a non-contact degradation evaluation method for insulated gate bipolar transistor (IGBT) modules is proposed based on eddy current pulsed thermography approach. In non-contact heat excitation procedures, a high-power induction heater is introduced to generate heat excitation in IGBT modules. The thermographs of the whole temperature mapping are recorded non-invasively by an IR camera. As a result, the joint degradation of IGBT modules can be evaluated by the transient thermal response curves derived from the recorded thermographs. Firstly, the non-destructive evaluation principle of the eddy current pulsed thermography (ECPT) system for an IGBT module with a heat sink is introduced. A 3D simulation module is built with physical parameters in ANSYS simulations, and then thermal propagation behavior considering the degradation impact is investigated. An experimental ECPT system is set up to verify the effectiveness of the proposed method. The experimental results show that the delay time to peak temperature can be extracted and treated as an effective indicative feature of joint degradation.
    Type of Medium: Online Resource
    ISSN: 1996-1073
    Language: English
    Publisher: MDPI AG
    Publication Date: 2020
    detail.hit.zdb_id: 2437446-5
    Location Call Number Limitation Availability
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  • 3
    Online Resource
    Online Resource
    Elsevier BV ; 2022
    In:  Microelectronics Reliability Vol. 138 ( 2022-11), p. 114702-
    In: Microelectronics Reliability, Elsevier BV, Vol. 138 ( 2022-11), p. 114702-
    Type of Medium: Online Resource
    ISSN: 0026-2714
    Language: English
    Publisher: Elsevier BV
    Publication Date: 2022
    detail.hit.zdb_id: 2022028-5
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