In:
ECS Transactions, The Electrochemical Society, Vol. 16, No. 10 ( 2008-10-03), p. 317-323
Abstract:
This paper discusses the fundamental challenges and reports the recent progress in enabling embedded Si:C (eSi:C) nMOS source/drain stressor technology. A thick oxide (SiON, Toxgl ~ 26Aå) long channel (Lgate in the range of 80nm-110nm, gate-pitch =336nm) nMOS device was used as the main test structure to evaluate the impact of eSi:C stressor to the device electrical characteristics, such as channel mobility and drive current. It was demonstrated that modifying the conventional Si CMOS fabrication process to accommodate the intrinsically meta-stable eSi:C material property is crucial in keeping carbon in its substitutional site thus to preserve strain in the eSi:C stressor throughout the device fabrication process. Significant channel mobility and drive current enhancement was demonstrated in the thick-oxide long-channel nMOS devices using in situ phosphorus-doped (ISPD) epitaxial eSi:C source/drain material.
Type of Medium:
Online Resource
ISSN:
1938-5862
,
1938-6737
Language:
Unknown
Publisher:
The Electrochemical Society
Publication Date:
2008
detail.hit.zdb_id:
2217591-X
detail.hit.zdb_id:
2251888-5
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