In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 55, No. 3 ( 2016-03-01), p. 036502-
Abstract:
Screen printing is a method commonly used for making electrodes for crystalline silicon solar cells. Although the screen-printing method is fast and easy, screen-printed electrodes have a porous structure, high contact resistance, and low aspect ratio. On the other hand, plated electrodes have low contact resistance and narrow electrode width. Therefore, the plating method could be substituted for the screen-printing method in crystalline silicon solar cells. During the plating process, ghost plating can appear at the surface when the quality of the passivation layer is poor, causing an increase in the recombination rate. In this paper, light-induced plating was applied to the fabrication of electrodes, and various passivation layers were investigated to remove ghost plating in crystalline silicon solar cells. These included, (1) SiN x deposited by plasma-enhanced chemical vapor deposition (PECVD), (2) a double SiN x layer formed by PECVD, (3) a double layer with thermal silicon oxide and SiN x deposited by PECVD, and (4) a double layer comprising SiN x and SiO x formed by PECVD. For the plated solar cells, a laser was used to remove various antireflection coating (ARC) layers and phosphoric acid was spin-coated onto the doped silicon wafer prior to laser ablation. Also, a screen-printed solar cell was fabricated to compare plated solar cells with screen-printed solar cells. As a result, we found that a thermal SiO 2 /PECVD SiN x layer showed the lowest pinhole density and its wet vapor transmission rate was characterized. The solar cell with the thermal SiO 2 /PECVD SiN x layer showed the lowest J 02 value, as well as improved V oc and J sc .
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.7567/JJAP.55.036502
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2016
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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