In:
Advanced Materials Research, Trans Tech Publications, Ltd., Vol. 845 ( 2013-12), p. 221-225
Abstract:
The growth of intermetallic phases in Al/Cu bilayers thin film having 2/3 layer thickness ratios were characterized by X-ray powder diffraction (XRD), energy dispersive X-ray (EDX) and transmission electron microscopy (TEM). In annealing temperature of 200 °C, the growth is controlled by Cu diffusion which resulted to formation of θ-Al 2 Cu, η-AlCu, ζ-Al 3 Cu 4 and γ-Al 4 Cu 9 phase.
Type of Medium:
Online Resource
ISSN:
1662-8985
DOI:
10.4028/www.scientific.net/AMR.845
DOI:
10.4028/www.scientific.net/AMR.845.221
Language:
Unknown
Publisher:
Trans Tech Publications, Ltd.
Publication Date:
2013
detail.hit.zdb_id:
2265002-7