In:
IEEE Transactions on Advanced Packaging, Institute of Electrical and Electronics Engineers (IEEE), Vol. 25, No. 2 ( 2002-5), p. 265-271
Type of Medium:
Online Resource
ISSN:
1521-3323
,
1557-9980
DOI:
10.1109/TADVP.2002.803306
Language:
Unknown
Publisher:
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date:
2002
detail.hit.zdb_id:
2070853-1