Effects of Melting Process on the Microstructure and Thermal Conductivity of Cu-10Ni-5Mo Alloy

Bai Ping Lu; Hui Xu; Can Cheng Liu

doi:10.4028/www.scientific.net/AMR.415-417.289

Paper Titles

Study on Speciation of Cr in Cement
p.272

Study on Hot Dip and Coating Structure of 55% Al-Zn Alloy Coated Steel
p.276

Study on Resilience of Mattress Foam and Body Pressure Distribution Characteristic of Mattress
p.281

Interaction Mechanism between In Situ Nb₂C-V₂C Nanoparticles and S/L Interface during the Rapid Solidification of Fe-Nb-V Alloy
p.285

Effects of Melting Process on the Microstructure and Thermal Conductivity of Cu-10Ni-5Mo Alloy
p.289

Friction and Wear Behavior of POM Composites Filled with LDPE and Wood Fibers
p.293

The Influence of Functionalized TiO₂ with Poly(methyl methacrylate) on the Mechanical Properties of TiO₂/Epoxy Nanocomposites
p.297

Transmission Line Characteristics Based on Metamaterials Substrate
p.302

Preparation of AlN-ZrO₂(Ca) Composites by Pressureless Sintering
p.306

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 415-417Effects of Melting Process on the Microstructure...

Effects of Melting Process on the Microstructure and Thermal Conductivity of Cu-10Ni-5Mo Alloy

Abstract:

Cu-10Ni-5Mo alloys have been prepared by arc-melting and induction melting injection moulding. The effects of melting processes on the microstructure and thermal conductivity of Cu-10Ni-5Mo alloys were studied. The results show that the grain of Cu-10Ni-5Mo alloy prepared by arc-melting is coarse and the structure includes α solid solution and Mo-Ni phase. The grain of Cu-10Ni-5Mo alloy prepared by induction melting injection moulding is superfine and the structure is α solid solution. Under this experiment condition, the coefficient of thermal conductivity of Cu-10Ni-5Mo alloy prepared by arc-melting is 56.9 W/(m•K)，while that of Cu-10Ni-5Mo alloy prepared by induction melting injection moulding is 35.7 W/(m•K). The melting points of Cu-10Ni-5Mo alloy prepared by two methods all increase and are little different.