ECS Meeting Abstracts

Strained Silicon on Wafer Level by Waferbonding: Materials Processing, Strain Measurements and Strain Relaxation

Silke H. Christiansen¹, Manfred Reiche¹, Michael Becker², Cameliu Himchinschi³ and Ulrich Gösele¹

© 2008 ECS - The Electrochemical Society
ECS Meeting Abstracts, Volume MA2008-02, E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications Citation Silke H. Christiansen et al 2008 Meet. Abstr. MA2008-02 2226 DOI 10.1149/MA2008-02/33/2226

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¹ Max-Planck Instiutute of Microstructure Physics

² IPHT

³ Chemnitz University of Technology

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