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  • 1
    Publication Date: 2022-05-25
    Description: Author Posting. © American Geophysical Union, 2007. This article is posted here by permission of American Geophysical Union for personal use, not for redistribution. The definitive version was published in Geochemistry Geophysics Geosystems 8 (2007): Q06022, doi:10.1029/2006GC001559.
    Description: From 55°45′E to 58°45′E and from 60°30′E to 62°00′E, the ultraslow-spreading Southwest Indian Ridge (SWIR) consists of magmatic spreading segments separated by oblique amagmatic spreading segments, transform faults, and nontransform discontinuities. Off-axis magnetic and multibeam bathymetric data permit investigation of the evolution of this part of the SWIR. Individual magmatic segments show varying magnitudes and directions of asymmetric spreading, which requires that the shape of the plate boundary has changed significantly over time. In particular, since 26 Ma the Atlantis II transform fault grew by 90 km to reach 199 km, while a 45-km-long transform fault at 56°30′E shrank to become an 11 km offset nontransform discontinuity. Conversely, an oblique amagmatic segment at the center of a first-order spreading segment shows little change in orientation with time. These changes are consistent with the clockwise rotation of two ~450-km-wide first-order spreading segments between the Gallieni and Melville transform faults (52–60°E) to become more orthogonal to spreading. We suggest that suborthogonal first-order spreading segments reflect a stable configuration for mid-ocean ridges that maximizes upwelling rates in the asthenospheric mantle and results in a hotter and weaker ridge-axis that can more easily accommodate seafloor spreading.
    Description: Funding for this work came from a JOI-Schlanger Fellowship to Baines and NSF grant 0352054 to Cheadle and John.
    Keywords: Southwest Indian Ridge ; Atlantis II fracture zone ; Asymmetric spreading ; Ridge segmentation
    Repository Name: Woods Hole Open Access Server
    Type: Article
    Format: application/pdf
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  • 2
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Residual stress in epoxy resin cured on Al plate was investigated by X-ray diffraction. Microdeformation of Al crystal can be detected as a shift of X-ray diffraction peak induced by the stress resided. Results show that Al plate is subjected to a uniaxial compressive stress of 29 MPa parallel to the adherend surface. In contrast to this, epoxy resin side (embedded particles) was found to be subjected to a uniaxial tensile stress. Experimental data have been compared with the calculated data and that obtained by the bimetallic method. On the basis of results, it is reasonable to conclude that Tg is a key factor determining the residual stress, and the difference of thermal expansion coefficients between Al plate and the cured epoxy resin from Tg to room temperature causes the residual stress. It has been shown that the X-ray diffraction method is useful to detect the stress at the interface between resin and adherend in situ and nondestructively.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 45 (1992), S. 1239-1244 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Residual stress in particulate epoxy resin was investigated by X-ray diffraction. Microdeformation of incorporated Al and α-SiO2 crystal, which was induced by the residual stress, could be detected as a shift of X-ray diffraction peak. The residual stress at the interface between the adherend and the particulate epoxy resin was found to decrease with the increase of volume fraction of filler. It was shown that the difference in the thermal expansion coefficients between the adherend and the particulate epoxy resin is much more effective on residual stress than the increment of Young's modulus owing to the incorporation of filler. When epoxy resin was cured on the Al plate, incorporated particles were subjected to a tensile stress; while cured on polytetrafluoroethylene sheet, particles were subjected to a compressive stress. The incorporation of some inorganic particles is considered effective to reduce the residual stress.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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