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  • 1
    Online Resource
    Online Resource
    American Vacuum Society ; 2004
    In:  Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena Vol. 22, No. 6 ( 2004-11-01), p. 3399-3404
    In: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 22, No. 6 ( 2004-11-01), p. 3399-3404
    Abstract: Low voltage scanning electron microscopy (SEM) metrology and inspection are performed by immersing the sample in an electric field; under this condition, when a scanning electron beam images a sample containing insulating features (like oxides and resist), a surface global charge builds up to offset the applied field and a transverse local field will form as a result of the scanning beam. The surface global charge is responsible for the voltage contrast and imaging properties, while local fields degrade image resolution. In this article we describe a simulation approach able to explain the imaging properties of charged surfaces and how resolution is affected by local fields. Using electron ray tracing in the column, the simulation follows both the emitted and primary electron trajectories outside the sample. In addition, Monte Carlo scattering simulation calculates the electron trajectory and charge deposition inside the sample. The resulting charge density is used to calculate the field inside and outside the sample by solving the Poisson equation with the proper boundary conditions. Ray tracing, Monte Carlo scattering simulation; and field equation are then integrated in a self-consistent fashion to form a simulation algorithm capable of explaining SEM imaging and charging. The simulation is applied to a variety of cases regarding both inspection and metrology. The results are compared with experiments. Furthermore a method to calculate surface charging will be given for both insulating surfaces and patterned insulating surfaces on a grounded substrate.
    Type of Medium: Online Resource
    ISSN: 1071-1023 , 1520-8567
    RVK:
    Language: English
    Publisher: American Vacuum Society
    Publication Date: 2004
    detail.hit.zdb_id: 3117331-7
    detail.hit.zdb_id: 3117333-0
    detail.hit.zdb_id: 1475429-0
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  • 2
    Online Resource
    Online Resource
    American Vacuum Society ; 2020
    In:  Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Vol. 38, No. 2 ( 2020-03-01)
    In: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 38, No. 2 ( 2020-03-01)
    Abstract: In this work, the authors evaluated the access resistance of InP high electron mobility transistors (HEMTs) and their degradation during wafer processing. The transfer resistance, which was rarely separated from other components of the total access resistance of InP HEMTs in the literature, was found to be the dominant component of the access resistance. It was also found that the transfer resistance degraded during wafer processing. The selection of the ohmic metal stack and its impact on both the metal-cap contact resistance and the transfer resistance was also investigated. The observations in their experiments and relevant discussions in the report are expected to be useful in the identification of improvement opportunities in both material growth and wafer fabrication of InP HEMTs.
    Type of Medium: Online Resource
    ISSN: 2166-2746 , 2166-2754
    RVK:
    Language: English
    Publisher: American Vacuum Society
    Publication Date: 2020
    detail.hit.zdb_id: 3117331-7
    detail.hit.zdb_id: 1475429-0
    Location Call Number Limitation Availability
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  • 3
    Online Resource
    Online Resource
    American Vacuum Society ; 2014
    In:  Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena Vol. 32, No. 3 ( 2014-05-01)
    In: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, American Vacuum Society, Vol. 32, No. 3 ( 2014-05-01)
    Abstract: Nanolaminates comprising of TiO2 or HfO2 sublayers within an Al2O3 matrix are grown with atomic layer deposition. These nanolaminates provide an improved silicon surface passivation compared to conventional Al2O3 films. The physical properties of the nanolaminates can be described with a dynamic growth model that considers initial and steady-state growth rates for the involved metal oxides. This model links the cycle ratios of the different atomic layer deposition precursors to the thickness and the material concentrations of the nanolaminate, which are determined by means of spectroscopic ellipsometry. Effective carrier lifetime measurements show that Al2O3-TiO2 nanolaminates achieve values of up to 6.0 ms at a TiO2 concentration of 0.2%. In Al2O3-HfO2 nanolaminates, a maximum effective carrier lifetime of 5.5 ms is reached at 7% HfO2. Electrical measurements show that the TiO2 incorporation causes strong hysteresis effects, which are linked to the trapping of negative charges and result in an enhanced field effect passivation. For the Al2O3-HfO2 nanolaminates, the capacitance data clearly show a very low density of interface traps (below 5·1010 eV−1·cm−2) and a reduction of the fixed charge density with increasing HfO2 concentration. Due to the low number of recombination centers near the surface, the reduced field effect passivation only had a minor impact on the effective carrier lifetime.
    Type of Medium: Online Resource
    ISSN: 2166-2746 , 2166-2754
    RVK:
    Language: English
    Publisher: American Vacuum Society
    Publication Date: 2014
    detail.hit.zdb_id: 3117331-7
    detail.hit.zdb_id: 1475429-0
    Location Call Number Limitation Availability
    BibTip Others were also interested in ...
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