In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 60, No. SB ( 2021-05-01), p. SBBC02-
Abstract:
Au redistribution layers 10 to 100 μ m wide were fabricated on heterogeneously integrated advanced flexible hybrid electronics (FHE) substrates formed by a die-first approach based on fan-out wafer-level packaging. The formed Au metal wiring was meticulously studied for locally induced mechanical stress upon bending (bending radius, BR 20 mm) using Laue microdiffraction (L μ D) with synchrotron radiation. It was inferred from the L μ D data that upon bending the FHE substrate up to the BR of 20 mm, the Au metal wiring (10 mm long, 100 μ m wide, and 500 nm thick) experienced mechanical bending stress amounting to 250 ∼ 300 MPa. The stress values obtained from the L μ D studies were close to the stress value of 350 MPa obtained by simulation.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.35848/1347-4065/abdb81
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2021
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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