In:
Japanese Journal of Applied Physics, IOP Publishing, Vol. 44, No. 10R ( 2005-10-01), p. 7409-
Abstract:
The presence of a particle on the backside of a wafer is commonly acknowledged to produce a deflection of the wafer when it is held on a flat surface by means of a pressure difference. We simulated this wafer topography, taking into account both elastic and plastic deformations. The simulations are backed up by experimental evidence. The results show that height variations of 100 nm can extend over several mm. At the same time, indentation and plastic deformation reduce the surface height variations to values that are orders of magnitude below those predicted in the ITRS roadmap.
Type of Medium:
Online Resource
ISSN:
0021-4922
,
1347-4065
DOI:
10.1143/JJAP.44.7409
Language:
Unknown
Publisher:
IOP Publishing
Publication Date:
2005
detail.hit.zdb_id:
218223-3
detail.hit.zdb_id:
797294-5
detail.hit.zdb_id:
2006801-3
detail.hit.zdb_id:
797295-7
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